SAMSUNG Electronics -Moldex3D

SAMSUNG Electronics Introduced Moldex3D As The Standard CAE Tool For Injection Molding

Customer Profile

Founded in 1938, SAMSUNG has maintained a mission statement that responds both to its own change, and to new developments in the world: “Economic contribution to the nation,” “Priority to human resources,” “Pursuit of rationalism.” Each slogan represents significant moments in SAMSUNG’s history, reflecting different stages of the company’s growth from a domestic industrial leader into a global consumer electronics powerhouse. (Source: www.samsung.com)

  • The Challenge:Adapt to the ever-changing and more challenging product design requirements.
  • The Solution: Reactive Injection Molding (RIM) is widely applied to provide an encapsulation that tolerates higher working temperature, and provides high reliability in thermal, mechanical and electrical property.
  • Key Benefits:Through Moldex3D, the design parameters and process conditions can be verified, eliminating physical prototyping and tedious trial-and-error.

There is no doubt that SAMSUNG Electronics is maintaining its market leadership in the global market (DRAM, SRAM, TFT-LCD, Color monitor, CPT & CDT, VCR, flash memory, Microwave, CDMA Handset, and so on), and SAMSUNG had sold 86.6 millions of its mobile phones in 2004, accounted for 12.7 percent share of the global market. Visual Display Group is one of top profit making departments. SAMSUNG Electronics maintains the top position in global market share of Color TVs, monitors. As one of few electronics companies with profound competencies in both A/V and IT, SAMSUNG have the foresight and willingness to make industry-leading investments in the future.

VPD (Virtual Product Development) is a popular topic nowadays. However, to achieve this goal not only requires professional developers, but suitable CAE software to benefit the collaborations. What we commonly understand are to evaluate the mechanical reliability, thermal management, electro-magnetic compatibility, and etc; but producibility should be considered as the key, since simulation tools for fabrication help to predict what will possibly occur during the production stage, which could save lots of possible expenses on trouble-shooting and the yield improvement.

Moldex3D can predict the short shot region

Mobile phone is always the focus in consuming electronics industries. In order to win people’s heart, all components need to be designed as fancy and exclusive among numerous new models. However, this demand is usually not easy to reach because the new design would be much more complex than traditional ones and is more challenging in the current molding technology. In this study, the short shot region is almost identical to the molded part, which goes on to prove the accuracy of Moldex3D. It guarantees the simulation result is valuable especially for exploring a revolutionary design.

Actual Sample Melt front

Cable encapsulation

Reactive Injection Molding (RIM) is widely applied to provide an encapsulation that tolerates higher working temperature, and provides high reliability in thermal, mechanical and electrical property. However, the resin is thermosets, of which chemorhelogy is more complex than thermoplastics. Through Moldex3D, the design parameters and process conditions can be verified, instead of physical prototyping and tedious trial-and-error.

Moldex3D scrutinizes each development stage for Samsung, ensuring the production quality

Through the introduction of the practical studies above, these cases demonstrate that Moldex3D possesses talented integrity for various purposes, widely from product conceptualization to prototyping stage. Moldex3D should definitely be in the list if you want to expand the VPD simulation tools to reach the optimum in such competitive business environment.

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